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NCV7707DQBR2G Tech Specifications
| Category | PMIC - Power Management - Specialized | |
| Manufacturer | ON Semiconductor | |
| Factory Lead Time | 30 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 36-BFSOP (0.295, 7.50mm Width) Exposed Pad | |
| Usage Level | Automotive grade | |
| Operating Temperature | -40°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Series | Automotive, AEC-Q100 | |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Terminal Finish | Nickel/Gold/Palladium (Ni/Au/Pd) | |
| Applications | Automotive | |
| Voltage - Supply | 5.5V~28V | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Current - Supply | 8mA | |
| Interface IC Type | INTERFACE CIRCUIT | |
| RoHS Status | ROHS3 Compliant |
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NCV7707DQBR2G Documents
Download datasheets and manufacturer documentation for NCV7707DQBR2G
- DatasheetsNCV7707(B)
- Environmental InformationMaterial Declaration NCV7707DQBR2G
- PCN Assembly/OriginNCV7707DQBR2G Plating/Bondwire Chg 31/Mar/2018
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