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- NSBC144EDXV6T1G
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NSBC144EDXV6T1G Tech Specifications
| Category | Transistors - Bipolar (BJT) - Arrays, Pre-Biased | |
| Manufacturer | ON Semiconductor | |
| Lifecycle Status | ACTIVE (Last Updated: 2 days ago) | |
| Factory Lead Time | 17 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | SOT-563, SOT-666 | |
| Surface Mount | YES | |
| Number of Pins | 6Pins | |
| Collector-Emitter Breakdown Voltage | 50V | |
| Number of Elements | 2 Elements | |
| hFEMin | 80 | |
| Packaging | Tape & Reel (TR) | |
| Published | 2010 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin (Sn) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -55°C | |
| Additional Feature | BUILT IN BIAS RESISTOR RATIO IS 1 | |
| Voltage - Rated DC | 50V | |
| Max Power Dissipation | 500mW |
| Terminal Form | FLAT | |
| Peak Reflow Temperature (Cel) | 260 | |
| Current Rating | 100mA | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Base Part Number | NSBC1* | |
| Pin Count | 6 | |
| Qualification Status | Not Qualified | |
| Max Output Current | 100mA | |
| Operating Supply Voltage | 50V | |
| Polarity | NPN | |
| Element Configuration | Dual | |
| Power Dissipation | 357mW | |
| Transistor Application | SWITCHING | |
| Transistor Type | 2 NPN - Pre-Biased (Dual) | |
| Collector Emitter Voltage (VCEO) | 50V | |
| Max Collector Current | 100mA | |
| DC Current Gain (hFE) (Min) @ Ic, Vce | 80 @ 5mA 10V | |
| Current - Collector Cutoff (Max) | 500nA | |
| Vce Saturation (Max) @ Ib, Ic | 250mV @ 300μA, 10mA | |
| Max Breakdown Voltage | 50V | |
| Resistor - Base (R1) | 47k Ω | |
| Continuous Collector Current | 100mA | |
| Resistor - Emitter Base (R2) | 47k Ω | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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NSBC144EDXV6T1G Documents
Download datasheets and manufacturer documentation for NSBC144EDXV6T1G
- PCN Design/SpecificationWire Bond 01/Dec/2010
- DatasheetsMUN5213DW1, NSBC144EDxx
- ReachStatementON-Semiconductor-company-79.pdf
- PCN Assembly/OriginWafer Source Addition 26/Nov/2014
- Environmental InformationMaterial Declaration NSBC144EDXV6T1G
- PCN PackagingMult Devices 27/Oct/2017 Carrier Tape 15/Aug/2017
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