- All Products
- /
- Fans, Thermal Management
- /
- Thermal - Pads, Sheets
- /
- TH997-288-192-2.5
Penchem Technologies Sdn Bhd TH997-288-192-2.5 Thermal Pads
2.4W/m-K 288.00mm x 192.00mm
IN STOCK
: 51
Min. : 1
Mult. : 1
Not available to buy on line? Want the lower wholesale price? Please sendRFQ, we will respond immediately
TH997-288-192-2.5 Tech Specifications
| Category | Thermal - Pads, Sheets | |
| Manufacturer | Microchip | |
| Material | Silicone | |
| Shape | Rectangular | |
| Series | TH997 | |
| Packaging | Sheet | |
| Part Status | Active | |
| Type | Gap Filler Pad, Sheet |
| Color | Blue | |
| Usage | Thermally Conductive | |
| Adhesive | Tacky - Both Sides | |
| Storage/Refrigeration Temperature | 68°F ~ 86°F (20°C ~ 30°C) | |
| Outline | 288.00mm x 192.00mm | |
| Thermal Conductivity | 2.4W/m-K | |
| Thickness | 0.0984" (2.500mm) |
Select at least one checkbox above to show similar products in this category.
Index :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ