1001-125-B Tech Specifications

Category Accessories
Manufacturer RAF
Package / Case 361-LFBGA
Mounting Type Surface Mount
Supplier Device Package 361-LFBGA (13x13)
Product Status Active
Mfr Renesas Electronics America Inc
Package Tray
For Use With/Related Products Panels
Series RZ/G2LC
Operating Temperature -40°C ~ 85°C (TA)
Speed 200MHz, 1.2GHz
Core Processor ARM® Cortex®-A55, ARM® Cortex®-M33
Specifications Brass, 3.81mm ID, #6-32 Thread
Voltage - I/O 1.8V, 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 3 Core, 64-Bit
Graphics Acceleration No
RAM Controllers DDR3L, DDR4
USB USB 2.0 (2)
Additional Interfaces CANbus, eMMC/SD/SDIO, I²C, SPI, UART
Co-Processors/DSP ARM® Mali-G31
Security Features AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Display & Interface Controllers MIPI/CSI, MIPI/DSI
SATA -
Hardware Type Retainer, Panel Screw
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