DA14706-00000HZ2 Tech Specifications

Category RF Transceiver ICs
Manufacturer Renesas
Mounting Type Panel Mount
Package / Case 142-VFBGA
Supplier Device Package 142-VFBGA (6.2x6)
Dielectric Material Liquid Crystal Polymer (LCP)
Shell Material, Finish Aluminum, Yellow Chromate Plated Cadmium
Voltage, Rating -
Package Bulk
Base Product Number MDM-3
Mfr ITT Cannon, LLC
Product Status Active
Contact Materials Copper Alloy
MSL MSL 3 - 168 hours
Qualification -
Maximum Clock Frequency 160 MHz, 2.4 GHz
Number of I/Os 79 I/OI/O
Maximum Data Rate 6 Mbps
Maximum Operating Temperature + 85 C
Supply Voltage-Max 4.75 V
Minimum Operating Temperature - 40 C
Supply Voltage-Min 2.9 V
Mounting Styles SMD/SMT
Supply Current Transmitting 3 mA
Supply Current Receiving 1.85 mA
Data RAM Size 1.5 MB
Operating Temperature -55°C ~ 200°C
Series 83513-Style Micro D Metal Shell (MDM)
Termination Wire Leads
Connector Type Receptacle, Female Sockets
Type TxRx + MCU
Number of Positions 37Positions
Color -
Number of Rows 2Rows
Subcategory Wireless & RF Integrated Circuits
Contact Type Signal
Current Rating (Amps) 3A
Technology Si
Voltage - Supply 2.9V ~ 4.75V
Ingress Protection -
Frequency 2.4GHz
Contact Finish Gold
Operating Frequency 2.4 GHz
Wire Gauge -
Flange Feature Cable Side, Male Jackscrew (2-56)
Interface Serial I2C/Serial I2
Memory Size 4kB OTP, 32kB ROM, 1.5MB SRAM
Connector Style D-Type, Micro-D
Program Memory Size -
Output Power 6 dBm
Data Bus Width 32 Bit
Contact Form -
Shell Size, Connector Layout 0.050 Pitch x 0.043 Row to Row
Product Type RF System on a Chip - SoC
Protocol Bluetooth v5.2
Power - Output 6dBm
Backset Spacing -
RF Family/Standard Bluetooth
Sensitivity -97dBm
Data Rate (Max) -
Serial Interfaces GPIO, I²C, I²S, PCM, PDM, SPI, UART, USB
Current - Receiving 1.85mA
Current - Transmitting 1.1mA ~ 5.2mA
Modulation -
GPIO 79
Features Shielded
Device Core ARM Cortex-M33
Contact Finish Thickness -
Material Flammability Rating -
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