R5F562T7DDFM Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Intersil
Surface Mount YES
Number of Terminals 64Terminals
Bundle Center to Mounting Center 131072
Part Life Cycle Code Active
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code QFP
Package Description LFQFP,
Clock Frequency-Max 12.5 MHz
Number of I/O Lines 37I/O Lines
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP64,.47SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Supply Voltage-Max 5.5 V
Supply Voltage-Min 5 V
Supply Voltage-Nom 5 V
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
Pin Count 64
JESD-30 Code S-PQFP-G64
Temperature Grade INDUSTRIAL
Speed 100 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 70 mA
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
Seated Height-Max 1.7 mm
Coil Type 8192
On Chip Program ROM Width 8
CPU Family RX
Boundary Scan YES
Low Power Mode YES
Format FLOATING POINT
Integrated Cache NO
Number of Timers 13Timers
ROM Programmability FLASH
Number of External Interrupts 9External Interrupts
On Chip Data RAM Width 8
Number of DMA Channels 1DMA Channel
Length 10 mm
Width 10 mm
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