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R5F5630DDDFP Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Intersil
Surface Mount YES
Contact plating gold-plated
Number of pins 27pins
Number of Terminals 100Terminals
Bundle Center to Mounting Center 1572864
Part Life Cycle Code Active
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code QFP
Package Description 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100
Clock Frequency-Max 16 MHz
Number of I/O Lines 79I/O Lines
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 1x27
Gross weight 1.57 g
Operating temperature -40...163°C
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
Current rating 1.5A
Pin Count 100
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Speed 100 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
Seated Height-Max 1.7 mm
Coil Type 131072
On Chip Program ROM Width 8
CPU Family RX
Rated voltage 60V
Number of Timers 26Timers
ROM Programmability FLASH
Profile beryllium copper
Length 14 mm
Width 14 mm
Plating thickness 0.75µm
Flammability rating UL94V-0
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