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R7F7015823AFP-C#AA3 Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Intersil
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Mfr Renesas Electronics Corporation
Number of I/Os 120I/Os
Data Converters A/D 24x10b, 24x12b
Qualification AEC-Q100
Base Product Number R7F7015823
Series RH850/F1K
Packaging Tray
Operating Temperature -40°C ~ 105°C (TA)
Part Status Active
Oscillator Type Internal
Speed 120MHz
RAM Size 160K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Core Processor RH850G3KH
Peripherals DMA, PWM, WDT
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 1.5MB (1.5M x 8)
Connectivity CANbus, CSI, I2C, LINbus, SPI, UART/USART
EEPROM Size 64K x 8
Grade Automotive
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R7F7015823AFP-C#AA3 Documents

Download datasheets and manufacturer documentation for   R7F7015823AFP-C#AA3

  • Datasheets
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