R7F7017143ABG-C#HC1 Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Intersil
Mounting Type Surface Mount
Package / Case 324-FBGA
Supplier Device Package 324-FBGA (19x19)
Mfr Renesas Electronics Corporation
Number of I/Os 246I/Os
Data Converters A/D 38x10, 32x12b
Base Product Number R7F7017143
Series RH850/F1KH
Packaging Tape & Reel (TR)
Operating Temperature -40°C ~ 105°C (TA)
Part Status Active
Oscillator Type Internal
Speed 240MHz
RAM Size 896K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Core Processor RH850G3KH
Peripherals DMA, PWM, WDT
Program Memory Type FLASH
Core Size 32-Bit Dual-Core
Program Memory Size 6MB (6M x 8)
Connectivity CANbus, CSI, I2C, LINbus, SPI, UART/USART
EEPROM Size 256K x 8
Select at least one checkbox above to show similar products in this category.
View Similar
R7F7017143ABG-C#HC1 brand manufacturers: Renesas Electronics Corporation, Elecinsight stock, R7F7017143ABG-C#HC1 reference price.Renesas Electronics Corporation. R7F7017143ABG-C#HC1 parameters, R7F7017143ABG-C#HC1 Datasheet PDF and pin diagram description download.You can use the R7F7017143ABG-C#HC1 Embedded - Microcontrollers, DSP Datesheet PDF, find R7F7017143ABG-C#HC1 pin diagram and circuit diagram and usage method of function,R7F7017143ABG-C#HC1 electronics tutorials.You can download from the Elecinsight.