RF Micro Devices Inc ML5824EM Telecom Interface ICs
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ML5824EM Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | RFMD | |
| Surface Mount | YES | |
| Number of Terminals | 28Terminals | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SIRENZA MICRODEVICES INC | |
| Part Package Code | QFN | |
| Package Description | HVQCCN, | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -10 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Supply Voltage-Nom | 3.2 V |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 28 | |
| JESD-30 Code | R-PQCC-N28 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL | |
| Seated Height-Max | 1 mm | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Length | 5 mm | |
| Width | 4 mm |
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ML5824EM Documents
Download datasheets and manufacturer documentation for ML5824EM
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