RF5722TR7 Tech Specifications

Category Interface - Telecom
Manufacturer RFMD
Surface Mount YES
Material polyolefin
Number of Terminals 8Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer RF MICRO DEVICES INC
Package Description 2.20 X 2.20 MM, 0.45 MM HEIGHT, GREEN, QFN-8
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Supply Voltage-Nom 3.3 V
Weight gross 39.25
Transport packaging size/quantity 103*26*26/200
Diameter before shrink 12 mm
Diameter after shrink 4 mm
Nominal diameter 12 mm
Wall thickness before shrink 0.68 mm
Packaging supplied in 1.0 m lengths
JESD-609 Code e3
ECCN Code 5A991.G
Type Heat shrink tubing with adhesive layer
Terminal Finish MATTE TIN
Color green
HTS Code 8517.70.00.00
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-XQCC-N8
Temperature Grade OTHER
Seated Height-Max 0.5 mm
Operating temperature range -55…+125 degrees C
Telecom IC Type TELECOM CIRCUIT
Shrink temperature 100 degrees C
Saturation Current 2
Operating voltage ≤1500 V
Shrink ratio 3 : 1
Width 2.2 mm
Length 1000 mm
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RF5722TR7 Documents

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