RF Micro Devices Inc RF5725 Telecom Interface ICs
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RF5725 Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | RFMD | |
| Surface Mount | YES | |
| Number of Terminals | 16Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | RF MICRO DEVICES INC | |
| Part Package Code | QFN | |
| Package Description | HVQCCN, | |
| Moisture Sensitivity Levels | 2 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -10 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Supply Voltage-Nom | 3.6 V | |
| JESD-609 Code | e3 |
| ECCN Code | 5A991.G | |
| Terminal Finish | Matte Tin (Sn) - annealed | |
| HTS Code | 8517.70.00.00 | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | unknown | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Pin Count | 16 | |
| JESD-30 Code | S-XQCC-N16 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL | |
| Seated Height-Max | 0.55 mm | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Length | 3 mm | |
| Width | 3 mm |
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RF5725 Documents
Download datasheets and manufacturer documentation for RF5725
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