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5962-8762902RA Tech Specifications

Category Logic - Buffers, Drivers, Receivers, Transceivers
Manufacturer Rochester Electronics
EU RoHS Not Compliant
ECCN (US) EAR99
Lead Shape Through Hole
Supplier Package CDIP
Standard Package Name DIP
PCB changed 20
Mounting Through Hole
Supplier Temperature Grade Military
Maximum Operating Temperature (°C) 125
Minimum Operating Temperature (°C) -55
Maximum Power Dissipation (mW) 500
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Supply Voltage (V) 4.5
Maximum Quiescent Current (uA) 1500
Maximum High Level Output Current (mA) -12
Maximum Low Level Output Current (mA) 48
Input Level TTL
Process Technology CMOS
Propagation Delay Test Condition (pF) 50
Maximum Propagation Delay Time @ Maximum CL (ns) 4.9@4.5V to 5.5V
Absolute Propagation Delay Time (ns) 6.5
Bus Hold No
Number of Direction Control Inputs 1 Low/HighDirection Control Input
Number of Input Enables per Element 0
Number of Output Enables per Element 1 Low
Number of Selection Inputs per Element 0
Number of Channels per Chip 8Channels per Chips
Number of Elements per Chip 1
Data Flow Direction Bi-Directional
Logic Family FCT
PPAP No
Automotive No
HTS 8542.39.00.01
Part Status Active
Pin Count 20
Output Type 3-State
Polarity Non-Inverting
Logic Function Bus Transceiver
Output Level TTL
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