DS1230AB-200 Tech Specifications

Category Memory
Manufacturer Rochester Electronics
Mounting Type Through Hole
Package / Case 28-DIP Module (0.600, 15.24mm)
Surface Mount NO
Memory Types Non-Volatile
Operating Temperature 0°C~70°C TA
Packaging Tube
Published 2007
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 28Terminations
Terminal Finish TIN LEAD
Additional Feature 10 YEARS DATA RETENTION PERIOD
Voltage - Supply 4.75V~5.25V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 240
Number of Functions 1Function
Supply Voltage 5V
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 28
JESD-30 Code R-XDMA-P28
Qualification Status COMMERCIAL
Supply Voltage-Max (Vsup) 5.25V
Supply Voltage-Min (Vsup) 4.75V
Memory Size 256Kb 32K x 8
Operating Mode ASYNCHRONOUS
Memory Format NVSRAM
Memory Interface Parallel
Organization 32KX8
Memory Width 8
Write Cycle Time - Word, Page 200ns
Memory Density 262144 bit
Access Time (Max) 200 ns
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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