XC1701LPD8C Tech Specifications

Category Memory - Configuration Proms for FPGAs
Manufacturer Rochester Electronics
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Operating Temperature 0°C~70°C
Packaging Tube
JESD-609 Code e0
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
Terminal Finish TIN LEAD
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
JESD-30 Code R-PDIP-T8
Qualification Status COMMERCIAL
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 1Mb
Operating Mode SYNCHRONOUS
Organization 1MX1
Memory Width 1
Memory Density 1048576 bit
Parallel/Serial SERIAL
Memory IC Type CONFIGURATION MEMORY
Length 9.3599mm
Height Seated (Max) 4.5974mm
Width 7.62mm
RoHS Status Non-RoHS Compliant
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