BU4S11G2 Tech Specifications

Category Logic - Gates and Inverters
Manufacturer ROHM Semiconductor
Surface Mount YES
Number of Terminals 5Terminals
RoHS Non-Compliant
Package Description LSSOP, TSOP5/6,.11,37
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Moisture Sensitivity Levels 1
Load Capacitance (CL) 50 pF
Package Body Material PLASTIC/EPOXY
Package Equivalence Code TSOP5/6,.11,37
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) 10
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number BU4S11G2
Supply Voltage-Nom (Vsup) 5 V
Package Code LSSOP
Package Shape RECTANGULAR
Manufacturer ROHM Semiconductor
Part Life Cycle Code Active
Ihs Manufacturer ROHM CO LTD
Risk Rank 2
Part Package Code SSOP
JESD-609 Code e3
Pbfree Code Yes
Terminal Finish Tin (Sn)
Max Operating Temperature 85 °C
Min Operating Temperature -40 °C
HTS Code 8542.39.00.01
Subcategory Gates
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.95 mm
Reach Compliance Code compliant
Pin Count 5
JESD-30 Code R-PDSO-G5
Number of Outputs 1Output
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 16 V
Power Supplies 5/15 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3 V
Number of Circuits 1Circuit
Max Supply Voltage 16 V
Min Supply Voltage 3 V
Propagation Delay 30 ns
Family 4000/14000/40000
Logic Function Inverting, NAND
Number of Inputs 2Inputs
Seated Height-Max 1.25 mm
Logic IC Type NAND GATE
Schmitt Trigger NO
Max Junction Temperature (Tj) 150 °C
Ambient Temperature Range High 85 °C
Height 1.25 mm
Width 1.6 mm
Length 2.9 mm
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