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BA6566 Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | ROHM Semiconductor | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | 18-DIP (0.300, 7.62mm) | |
| Operating Temperature | -35°C~60°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2006 | |
| JESD-609 Code | e3/e2 | |
| Pbfree Code | yes | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 18Terminations | |
| Terminal Finish | TIN/TIN COPPER | |
| Max Power Dissipation | 1.1W | |
| Voltage - Supply | 1.15V~1.27V |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 2.54mm | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Base Part Number | BA6566 | |
| Function | Speech Network IC | |
| Qualification Status | Not Qualified | |
| Power Supplies | 2/7V | |
| Number of Circuits | 1Circuit | |
| Telecom IC Type | TELEPHONE SPEECH CIRCUIT | |
| Length | 22.9mm | |
| Height Seated (Max) | 4.25mm | |
| Width | 7.62mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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BA6566 Documents
Download datasheets and manufacturer documentation for BA6566
- DatasheetsBA6566/F/FP
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