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- BA6566FP-E2
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BA6566FP-E2 Tech Specifications
Category | Interface - Telecom | |
Manufacturer | ROHM Semiconductor | |
Factory Lead Time | 6 Weeks | |
Mount | Surface Mount | |
Packaging | Tape & Reel (TR) | |
Published | 1998 | |
JESD-609 Code | e3/e2 | |
Pbfree Code | yes | |
Part Status | Not For New Designs | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 26Terminations | |
Terminal Finish | TIN/TIN COPPER | |
Max Operating Temperature | 60°C | |
Min Operating Temperature | -35°C | |
Max Power Dissipation | 1.35W | |
Terminal Position | DUAL | |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 | |
Number of Functions | 1Function | |
Terminal Pitch | 0.8mm | |
Time@Peak Reflow Temperature-Max (s) | 10 | |
Pin Count | 24 | |
JESD-30 Code | R-PDSO-G26 | |
Qualification Status | Not Qualified | |
Power Supplies | 2/7V | |
Temperature Grade | OTHER | |
Number of Circuits | 1Circuit | |
Max Supply Voltage | 1.27V | |
Min Supply Voltage | 1.15V | |
Telecom IC Type | TELEPHONE SPEECH CIRCUIT | |
Width | 5.4mm | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
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BA6566FP-E2 Documents
Download datasheets and manufacturer documentation for BA6566FP-E2
- DatasheetsBA6566/F/FP
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