BH6179GU-E2 Tech Specifications

Category Specialized
Manufacturer ROHM Semiconductor
Mounting Type Surface Mount
Package / Case 24-VFBGA, CSPBGA
Supplier Device Package 24-VCSP
Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Blue Anodized
Package Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
Base Product Number BH6179
Mfr Rohm Semiconductor
Product Status Last Time Buy
Series pushPIN™
Operating Temperature -
Part Status Active
Type Top Mount
Applications Handheld/Mobile Devices
Voltage - Supply 2.2V ~ 5.5V
Attachment Method Push Pin
Height Off Base (Height of Fin) 0.984 (25.00mm)
Thermal Resistance @ Forced Air Flow 5.48°C/W @ 100 LFM
Current - Supply -
Thermal Resistance @ Natural --
Power Dissipation @ Temperature Rise --
Width 1.181 (30.00mm)
Length 1.181 (30.00mm)
Diameter --
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