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- BR25H128FVT-2ACE2
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BR25H128FVT-2ACE2 Tech Specifications
| Category | Memory | |
| Manufacturer | ROHM Semiconductor | |
| Factory Lead Time | 15 Weeks | |
| Surface Mount | YES | |
| Package / Case | 8-TSSOP (0.173, 4.40mm Width) | |
| Mounting Type | Surface Mount | |
| Memory Types | Non-Volatile | |
| Usage Level | Automotive grade | |
| Series | Automotive, AEC-Q100 | |
| Packaging | Cut Tape (CT) | |
| Operating Temperature | -40°C~125°C TA | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 8Terminations | |
| Voltage - Supply | 2.5V~5.5V | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.65mm | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PDSO-G8 | |
| Supply Voltage-Max (Vsup) | 5.5V | |
| Supply Voltage-Min (Vsup) | 2.5V | |
| Memory Size | 128Kb 16K x 8 | |
| Operating Mode | SYNCHRONOUS | |
| Clock Frequency | 10MHz | |
| Memory Format | EEPROM | |
| Memory Interface | SPI | |
| Organization | 16KX8 | |
| Memory Width | 8 | |
| Write Cycle Time - Word, Page | 4ms | |
| Memory Density | 131072 bit | |
| Parallel/Serial | SERIAL | |
| Serial Bus Type | SPI | |
| Write Cycle Time-Max (tWC) | 4ms | |
| Length | 4.4mm | |
| Width | 3mm | |
| Height Seated (Max) | 1.2mm | |
| RoHS Status | ROHS3 Compliant |
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BR25H128FVT-2ACE2 Documents
Download datasheets and manufacturer documentation for BR25H128FVT-2ACE2
- Other Related DocumentsAEC-Q101 Automotive Requirements
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