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K4S640832H-UC75 Tech Specifications

Category Memory
Manufacturer Samsung
Surface Mount YES
Number of Terminals 54Terminals
Package Style SMALL OUTLINE, THIN PROFILE
Moisture Sensitivity Levels 3
Number of Words Code 8000000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code TSOP54,.46,32
Access Time-Max 5.4 ns
Operating Temperature-Max 70 °C
Rohs Code Yes
Manufacturer Part Number K4S640832H-UC75
Clock Frequency-Max (fCLK) 133 MHz
Number of Words 8388608 wordsWord
Supply Voltage-Nom (Vsup) 3.3 V
Package Code TSOP
Package Shape RECTANGULAR
Manufacturer Samsung Semiconductor
Part Life Cycle Code Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Risk Rank 5.73
JESD-609 Code e6
Terminal Finish Tin/Bismuth (Sn/Bi)
Subcategory DRAMs
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PDSO-G54
Qualification Status Not Qualified
Power Supplies 3.3 V
Temperature Grade COMMERCIAL
Supply Current-Max 0.135 mA
Organization 8MX8
Output Characteristics 3-STATE
Memory Width 8
Standby Current-Max 0.001 A
Memory Density 67108864 bit
I/O Type COMMON
Memory IC Type SYNCHRONOUS DRAM
Refresh Cycles 4096
Sequential Burst Length 1,2,4,8,FP
Interleaved Burst Length 1,2,4,8
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