M386A8K40CM2-CVFBQ Tech Specifications

Category Memory Cards
Manufacturer Samsung
HTS 8473.30.11.40
Module DRAM Module
Module Density 64Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 16G
Data Bus Width (bit) 72
Max. Access Time (ns) 0.165
Maximum Clock Rate (MHz) 2933
Chip Configuration 4Gx4
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Supplier Temperature Grade Extended
Module Sides Double
ECC Support Yes
Number of Ranks QuadRank
Number of Chip Banks 16Chip Banks
CAS Latency 21
SPD EEPROM Support No
Standard Package Name DIM
Supplier Package RDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
Package Width 4.3(Max)
PCB changed 288
Part Status Active
Pin Count 288
Organization 8Gx72
PLL No
Self Refresh Yes
Module Type 288LRDIMM
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