M386A8K40DM2-CWEB Tech Specifications

Category Memory Cards
Manufacturer Samsung
ECCN (US) 4A994.a
HTS 8473.30.11.40
Module DRAM Module
Module Density 64Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 16G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2133
Chip Configuration 4Gx4
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
ECC Support No
Number of Chip Banks 16Chip Banks
CAS Latency 15
Part Status LTB
Organization 8Gx72
Module Type 288RDIMM
RoHS Status RoHS Compliant
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