M391A1K43BB1-CRC Tech Specifications

Category Memory Cards
Manufacturer Samsung
Surface Mount NO
Number of Terminals 288Terminals
ECCN (US) 4A994.a
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 9Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2400
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
ECC Support Yes
Number of Ranks SingleRank
CAS Latency 17
Standard Package Name DIM
Supplier Package UDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
Package Width 3.9(Max)
PCB changed 288
Lead Shape No Lead
Package Description DIMM,
Package Style MICROELECTRONIC ASSEMBLY
Number of Words Code 1000000000Words Codes
Package Body Material UNSPECIFIED
Manufacturer Part Number M391A1K43BB1-CRC
Number of Words 1073741824 wordsWord
Supply Voltage-Nom (Vsup) 1.2 V
Package Code DIMM
Package Shape RECTANGULAR
Manufacturer Samsung Semiconductor
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Risk Rank 5.75
Part Status Obsolete
Additional Feature AUTO/SELF REFRESH; WD-MAX
Technology CMOS
Terminal Position DUAL
Terminal Form NO LEAD
Number of Functions 1Function
Terminal Pitch 0.85 mm
Reach Compliance Code compliant
Pin Count 288
JESD-30 Code R-XDMA-N288
Supply Voltage-Max (Vsup) 1.26 V
Supply Voltage-Min (Vsup) 1.14 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Organization 1Gx72
Seated Height-Max 31.25 mm
Memory Width 72
Memory Density 77309411328 bit
Memory IC Type DDR DRAM MODULE
Access Mode SINGLE BANK PAGE BURST
Self Refresh YES
Module Type 288UDIMM
Width 4.1 mm
Length 133.35 mm
RoHS Status RoHS Compliant
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