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Samsung Electronics M393A1G40EB2-CTD Memory Cards
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M393A1G40EB2-CTD Tech Specifications
| Category | Memory Cards | |
| Manufacturer | Samsung | |
| ECCN (US) | EAR99 | |
| Module | DRAM Module | |
| Module Density | 8Gbyte | |
| Number of Chip per Module | 18Chip per Modules | |
| Chip Density (bit) | 4G | |
| Data Bus Width (bit) | 72 | |
| Maximum Clock Rate (MHz) | 1333 | |
| Chip Configuration | 1Gx4 | |
| Minimum Operating Supply Voltage (V) | 1.14 | |
| Typical Operating Supply Voltage (V) | 1.2 | |
| Maximum Operating Supply Voltage (V) | 1.26 | |
| Module Sides | Double | |
| ECC Support | Yes | |
| Number of Ranks | SingleRank |
| Number of Chip Banks | 16Chip Banks | |
| CAS Latency | 19 | |
| SPD EEPROM Support | No | |
| Supplier Package | RDIMM | |
| Mounting | Socket | |
| Package Height | 31.25 | |
| Package Length | 133.35 | |
| Package Width | 1.4 + 2.8(Max) | |
| PCB changed | 288 | |
| Part Status | Active | |
| Pin Count | 288 | |
| Organization | 1Gx72 | |
| PLL | No | |
| Self Refresh | Yes | |
| Module Type | 288RDIMM | |
| RoHS Status | RoHS Compliant |
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M393A1G40EB2-CTD Documents
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