M393A1G43DB1-CRC00 Tech Specifications

Category Memory Cards
Manufacturer Samsung
HTS 8473.30.11.40
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2400
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Operating Current (mA) 1860
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
CAS Latency 17
SPD EEPROM Support No
Supplier Package RDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
Package Width 4.3(Max)
PCB changed 288
Part Status Obsolete
Pin Count 288
Organization 1Gx72
PLL No
Self Refresh Yes
Module Type 288RDIMM
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