M393A2K40CB2-CTD Tech Specifications

Category Memory Cards
Manufacturer Samsung
ECCN (US) 4A994.a
HTS 8473.30.11.40
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2666
Chip Configuration 2Gx4
Chip Package Type 78FBGA
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
ECC Support No
Number of Ranks SingleRank
Number of Chip Banks 16Chip Banks
CAS Latency 19
Standard Package Name DIM
Supplier Package RDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
Package Width 4.3(Max)
PCB changed 288
Lead Shape No Lead
Manufacturer Part Number M393A2K40CB2-CTD
Manufacturer Samsung Semiconductor
Part Life Cycle Code Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Risk Rank 5.72
Part Status Active
Reach Compliance Code compliant
Pin Count 288
Organization 2Gx72
Memory IC Type DDR DRAM MODULE
Module Type 288RDIMM
RoHS Status RoHS Compliant
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