M393A2K43BB1-CTD Tech Specifications

Category Memory Cards
Manufacturer Samsung
ECCN (US) 4A994.a
HTS 8473.30.11.40
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2666
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
ECC Support No
Number of Ranks DualRank
CAS Latency 19
Standard Package Name DIM
Supplier Package RDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
Package Width 3.9(Max)
PCB changed 288
Lead Shape No Lead
Part Status Active
Pin Count 288
Organization 2Gx72
Module Type 288RDIMM
RoHS Status RoHS Compliant
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