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Samsung Electronics M393A2K43BB1-CTD8Q Memory Cards
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M393A2K43BB1-CTD8Q Tech Specifications
| Category | Memory Cards | |
| Manufacturer | Samsung | |
| ECCN (US) | 4A994.a | |
| HTS | 8542.32.00.71 | |
| Module | DRAM Module | |
| Module Density | 16Gbyte | |
| Number of Chip per Module | 18Chip per Modules | |
| Chip Density (bit) | 8G | |
| Data Bus Width (bit) | 72 | |
| Maximum Clock Rate (MHz) | 2666 | |
| Chip Configuration | 1Gx8 | |
| Chip Package Type | FBGA | |
| Typical Operating Supply Voltage (V) | 1.2 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 85 | |
| Supplier Temperature Grade | Commercial |
| ECC Support | No | |
| Number of Ranks | DualRank | |
| CAS Latency | 19 | |
| Standard Package Name | DIM | |
| Supplier Package | RDIMM | |
| Mounting | Socket | |
| Package Height | 31.25 | |
| Package Length | 133.35 | |
| Package Width | 3.9(Max) | |
| PCB changed | 288 | |
| Lead Shape | No Lead | |
| Part Status | Active | |
| Pin Count | 288 | |
| Organization | 2Gx72 | |
| Module Type | 288RDIMM | |
| RoHS Status | RoHS Compliant |
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M393A2K43BB1-CTD8Q Documents
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