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Samsung Electronics M393B2873GB0-CH908 Memory Cards
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M393B2873GB0-CH908 Tech Specifications
| Category | Memory Cards | |
| Manufacturer | Samsung | |
| ECCN (US) | 4A994.a | |
| HTS | 8542.31.00.01 | |
| Module | DRAM Module | |
| Module Density | 1Gbyte | |
| Number of Chip per Module | 9Chip per Modules | |
| Chip Density (bit) | 1G | |
| Data Bus Width (bit) | 72 | |
| Maximum Clock Rate (MHz) | 1333 | |
| Chip Configuration | 128Mx8 | |
| Chip Package Type | 78FBGA | |
| Minimum Operating Supply Voltage (V) | 1.425 | |
| Typical Operating Supply Voltage (V) | 1.5 | |
| Maximum Operating Supply Voltage (V) | 1.575 | |
| Operating Current (mA) | 1310 |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 95 | |
| ECC Support | No | |
| Number of Ranks | SingleRank | |
| CAS Latency | 9 | |
| Supplier Package | RDIMM | |
| Mounting | Socket | |
| Package Height | 30 | |
| Package Length | 133.35 | |
| Package Width | 4(Max) | |
| PCB changed | 240 | |
| Part Status | Obsolete | |
| Pin Count | 240 | |
| Organization | 128Mx72 | |
| Module Type | 240RDIMM |
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M393B2873GB0-CH908 Documents
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