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M393B2G70QH0-CK0 Tech Specifications

Category Memory Cards
Manufacturer Samsung
Surface Mount NO
Number of Terminals 240Terminals
ECCN (US) 4A994.a
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1600
Chip Configuration 1Gx4
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 2800
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support No
Number of Ranks DualRank
CAS Latency 11
SPD EEPROM Support Yes
Standard Package Name DIMM
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Package Description DIMM,
Package Style MICROELECTRONIC ASSEMBLY
Number of Words Code 2000000000Words Codes
Package Body Material UNSPECIFIED
Operating Temperature-Max 85 °C
Manufacturer Part Number M393B2G70QH0-CK0
Number of Words 2147483648 wordsWord
Supply Voltage-Nom (Vsup) 1.5 V
Package Code DIMM
Package Shape RECTANGULAR
Manufacturer Samsung Semiconductor
Part Life Cycle Code Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Risk Rank 5.7
Part Status Obsolete
Additional Feature AUTO/SELF REFRESH; WD-MAX
Technology CMOS
Terminal Position DUAL
Terminal Form NO LEAD
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code compliant
Pin Count 240
JESD-30 Code R-XDMA-N240
Supply Voltage-Max (Vsup) 1.575 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.425 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Organization 2Gx72
Seated Height-Max 30.15 mm
Memory Width 72
Memory Density 154618822656 bit
PLL No
Memory IC Type DDR DRAM MODULE
Access Mode DUAL BANK PAGE BURST
Self Refresh Yes
Module Type 240RDIMM
Width 4 mm
Length 133.35 mm
RoHS Status RoHS Compliant
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