M393B2K70CM0-CF8 Tech Specifications

Category Memory Cards
Manufacturer Samsung
ECCN (US) 4A994.a
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 4G(DDP)
Data Bus Width (bit) 72
Max. Access Time (ns) 0.3
Maximum Clock Rate (MHz) 1066
Chip Configuration 1Gx4
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 4734
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support Yes
Number of Ranks QuadRank
Number of Chip Banks 8Chip Banks
CAS Latency 7
SPD EEPROM Support Yes
Standard Package Name DIMM
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 2Gx72
PLL No
Self Refresh Yes
Module Type 240RDIMM
RoHS Status RoHS Compliant
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