Elecinsight electronic parts stores,electronic components,electronic parts,electronics parts supply
My List
Order Status & History RFQ History WISH LIST
$ 0.00

M470T2864EH3-CE6 Tech Specifications

Category Memory Cards
Manufacturer Samsung
ECCN (US) 4A994.a
Module DRAM Module
Module Density 1Gbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 1G
Data Bus Width (bit) 64
Max. Access Time (ns) 0.45
Maximum Clock Rate (MHz) 667
Chip Configuration 64Mx16
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Operating Current (mA) 428
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support No
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 5
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package USODIMM
Mounting Socket
Package Height 30
Package Length 67.6
Package Width 3.8(Max)
PCB changed 200
Lead Shape No Lead
Part Status Obsolete
Pin Count 200
Organization 128Mx64
PLL No
Self Refresh Yes
Module Type 200SODIMM
RoHS Status RoHS Compliant
Select at least one checkbox above to show similar products in this category.
View Similar

M470T2864EH3-CE6 Documents

Download datasheets and manufacturer documentation for   M470T2864EH3-CE6

M470T2864EH3-CE6 brand manufacturers: Samsung Electronics, Elecinsight stock, M470T2864EH3-CE6 reference price.Samsung Electronics. M470T2864EH3-CE6 parameters, M470T2864EH3-CE6 Datasheet PDF and pin diagram description download.You can use the M470T2864EH3-CE6 Memory Cards, DSP Datesheet PDF, find M470T2864EH3-CE6 pin diagram and circuit diagram and usage method of function,M470T2864EH3-CE6 electronics tutorials.You can download from the Elecinsight.