M471A1G43DB0-CPB0 Tech Specifications

Category Memory Cards
Manufacturer Samsung
ECCN (US) EAR99
HTS 8542.32.00.71
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 2133
Chip Configuration 512Mx8
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Operating Current (mA) 890
ECC Support No
Number of Ranks DualRank
CAS Latency 15
Supplier Package USODIMM
Mounting Socket
Package Height 30
Package Length 69.6
Package Width 3.7(Max)
PCB changed 260
Part Status Obsolete
Pin Count 260
Organization 1Gx64
Module Type 260USODIMM
RoHS Status RoHS Compliant
Select at least one checkbox above to show similar products in this category.
View Similar

M471A1G43DB0-CPB0 Documents

Download datasheets and manufacturer documentation for   M471A1G43DB0-CPB0

M471A1G43DB0-CPB0 brand manufacturers: Samsung Electronics, Elecinsight stock, M471A1G43DB0-CPB0 reference price.Samsung Electronics. M471A1G43DB0-CPB0 parameters, M471A1G43DB0-CPB0 Datasheet PDF and pin diagram description download.You can use the M471A1G43DB0-CPB0 Memory Cards, DSP Datesheet PDF, find M471A1G43DB0-CPB0 pin diagram and circuit diagram and usage method of function,M471A1G43DB0-CPB0 electronics tutorials.You can download from the Elecinsight.