M471A1G43DB1-CRC000 Tech Specifications

Category Memory Cards
Manufacturer Samsung
ECCN (US) 4A994.a
HTS 8542.32.00.71
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 2400
Chip Configuration 512Mx8
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Supplier Temperature Grade Commercial
ECC Support No
Number of Ranks DualRank
CAS Latency 17
Supplier Package SODIMM
Mounting Socket
PCB changed 260
Pin Count 260
Organization 1Gx64
Module Type 204USODIMM
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