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Samsung Electronics M471A5244CB0-CRC Memory Cards
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M471A5244CB0-CRC Tech Specifications
| Category | Memory Cards | |
| Manufacturer | Samsung | |
| ECCN (US) | 4A994.a | |
| HTS | 8473.30.11.40 | |
| Module | DRAM Module | |
| Module Density | 4Gbyte | |
| Number of Chip per Module | 8Chip per Modules | |
| Chip Density (bit) | 8G | |
| Data Bus Width (bit) | 64 | |
| Maximum Clock Rate (MHz) | 2400 | |
| Chip Configuration | 512Mx16 | |
| Chip Package Type | FBGA | |
| Typical Operating Supply Voltage (V) | 1.2 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 85 | |
| Supplier Temperature Grade | Commercial |
| ECC Support | No | |
| Number of Ranks | SingleRank | |
| CAS Latency | 17 | |
| Standard Package Name | DIM | |
| Supplier Package | SODIMM | |
| Mounting | Socket | |
| Package Height | 30 | |
| Package Length | 69.6 | |
| Package Width | 3.7(Max) | |
| PCB changed | 260 | |
| Lead Shape | No Lead | |
| Part Status | Active | |
| Pin Count | 260 | |
| Organization | 512Mx64 | |
| Module Type | 260SODIMM | |
| RoHS Status | RoHS Compliant |
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M471A5244CB0-CRC Documents
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