M471B1G73QH0-YK0 Tech Specifications

Category Memory Cards
Manufacturer Samsung
Surface Mount NO
Number of Terminals 204Terminals
ECCN (US) EAR99
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Typical Operating Supply Voltage (V) 1.35
ECC Support No
Number of Ranks DualRank
CAS Latency 11
Standard Package Name DIM
Supplier Package SODIMM
Mounting Socket
PCB changed 204
Lead Shape No Lead
RoHS Non-Compliant
Package Description DIMM,
Package Style MICROELECTRONIC ASSEMBLY
Number of Words Code 1000000000Words Codes
Package Body Material UNSPECIFIED
Operating Temperature-Max 85 °C
Manufacturer Part Number M471B1G73QH0-YK0
Number of Words 1073741824 wordsWord
Supply Voltage-Nom (Vsup) 1.35 V
Package Code DIMM
Package Shape RECTANGULAR
Manufacturer Samsung Semiconductor
Part Life Cycle Code Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Risk Rank 5.67
Part Status Obsolete
Additional Feature AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX
Technology CMOS
Terminal Position DUAL
Terminal Form NO LEAD
Number of Functions 1Function
Terminal Pitch 0.6 mm
Reach Compliance Code compliant
Pin Count 204
JESD-30 Code R-XDMA-N204
Supply Voltage-Max (Vsup) 1.45 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.283 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Organization 1Gx64
Seated Height-Max 30.13 mm
Memory Width 64
Memory Density 68719476736 bit
Memory IC Type DDR DRAM MODULE
Access Mode DUAL BANK PAGE BURST
Self Refresh YES
Module Type SODIMM
Width 3.8 mm
Length 67.6 mm
RoHS Status RoHS Compliant
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