M471B1G73QH0-YK000 Tech Specifications

Category Memory Cards
Manufacturer Samsung
ECCN (US) EAR99
HTS 8473.30.11.80
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Typical Operating Supply Voltage (V) 1.35
ECC Support No
Number of Ranks DualRank
CAS Latency 11
Standard Package Name DIM
Supplier Package SODIMM
Mounting Socket
PCB changed 204
Lead Shape No Lead
Part Status Obsolete
Pin Count 204
Organization 1Gx64
Module Type SODIMM
RoHS Status RoHS Compliant
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