M471B5173DB0-YK000 Tech Specifications

Category Memory Cards
Manufacturer Samsung
ECCN (US) 4A994.a
HTS 8473.30.11.40
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.35
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support No
Number of Ranks SingleRank
CAS Latency 11
Standard Package Name DIM
Supplier Package USODIMM
Mounting Socket
Package Height 30
Package Length 67.6
Package Width 3.8(Max)
PCB changed 204
Lead Shape No Lead
Part Status Obsolete
Pin Count 204
Organization 512Mx64
Module Type 204USODIMM
RoHS Status RoHS Compliant
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