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M471B5773DH0-CH900 Tech Specifications

Category Memory Cards
Manufacturer Samsung
ECCN (US) 4A994.a
HTS 8542.32.00.71
Module DRAM Module
Module Density 2Gbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 2G
Data Bus Width (bit) 64
Max. Access Time (ns) 0.255
Maximum Clock Rate (MHz) 1333
Chip Configuration 256Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 640
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support No
Number of Ranks SingleRank
Number of Chip Banks 8Chip Banks
CAS Latency 9
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package USODIMM
Mounting Socket
Package Height 30
Package Length 67.6
Package Width 3.8(Max)
PCB changed 204
Lead Shape No Lead
RoHS Compliant
Part Status Obsolete
Pin Count 204
Organization 256Mx64
PLL No
Self Refresh Yes
Module Type 204USODIMM
RoHS Status RoHS Compliant
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