M474A1G43DB1-CRC000 Tech Specifications

Category Memory Cards
Manufacturer Samsung
ECCN (US) EAR99
HTS 8542.32.00.71
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2400
Chip Configuration 512Mx8
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Operating Current (mA) 1100
ECC Support Yes
Number of Ranks DualRank
CAS Latency 17
Supplier Package USODIMM
Mounting Socket
Package Height 30
Package Length 69.6
Package Width 3.7(Max)
PCB changed 260
Part Status Obsolete
Pin Count 260
Organization 1Gx72
Module Type 260USODIMM
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