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Samsung Electronics M474B1G73QH0-YK000 Memory Cards
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M474B1G73QH0-YK000 Tech Specifications
| Category | Memory Cards | |
| Manufacturer | Samsung | |
| ECCN (US) | EAR99 | |
| HTS | 8473.30.51.00 | |
| Module | DRAM Module | |
| Module Density | 8Gbyte | |
| Number of Chip per Module | 18Chip per Modules | |
| Chip Density (bit) | 4G | |
| Data Bus Width (bit) | 72 | |
| Maximum Clock Rate (MHz) | 1600 | |
| Chip Configuration | 512Mx8 | |
| Chip Package Type | 78FBGA | |
| Minimum Operating Supply Voltage (V) | 1.283/1.425 | |
| Typical Operating Supply Voltage (V) | 1.35/1.5 | |
| Maximum Operating Supply Voltage (V) | 1.45/1.575 | |
| Operating Current (mA) | 1125 | |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 95 | |
| ECC Support | Yes | |
| Number of Ranks | DualRank | |
| CAS Latency | 11 | |
| Standard Package Name | DIM | |
| Supplier Package | USODIMM | |
| Mounting | Socket | |
| Package Height | 30 | |
| Package Length | 67.6 | |
| Package Width | 3.8(Max) | |
| PCB changed | 204 | |
| Lead Shape | No Lead | |
| Part Status | Obsolete | |
| Pin Count | 204 | |
| Organization | 1Gx72 | |
| Module Type | 204USODIMM |
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M474B1G73QH0-YK000 Documents
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