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- K4H511638D-ZCCC000
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K4H511638D-ZCCC000 Tech Specifications
| Category | Memory | |
| Manufacturer | Samsung | |
| EU RoHS | Compliant | |
| ECCN (US) | EAR99 | |
| Automotive | No | |
| PPAP | No | |
| DRAM Type | DDR SDRAM | |
| Chip Density (bit) | 512M | |
| Number of Internal Banks | 4Internal Banks | |
| Number of Words per Bank | 8M | |
| Number of Bits/Word (bit) | 16Bits/Word (bit)s | |
| Data Bus Width (bit) | 16 | |
| Maximum Clock Rate (MHz) | 400 | |
| Maximum Access Time (ns) | 0.65 | |
| Address Bus Width (bit) | 15 | |
| Interface Type | SSTL_2 | |
| Minimum Operating Supply Voltage (V) | 2.5 | |
| Typical Operating Supply Voltage (V) | 2.6 |
| Maximum Operating Supply Voltage (V) | 2.7 | |
| Operating Current (mA) | 400 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 70 | |
| Supplier Temperature Grade | Commercial | |
| Number of I/O Lines (bit) | 16I/O Lines (bit)s | |
| Mounting | Surface Mount | |
| Package Height | 1 | |
| Package Width | 10 | |
| Package Length | 12 | |
| PCB changed | 60 | |
| Standard Package Name | BGA | |
| Supplier Package | FBGA | |
| Lead Shape | Ball | |
| Part Status | Obsolete | |
| Pin Count | 60 | |
| Organization | 32Mx16 |
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