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K4M28163LH-BN75 Tech Specifications

Category Memory
Manufacturer Samsung
Surface Mount YES
Number of Terminals 54Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description FBGA, BGA54,9X9,32
Access Time-Max 5.4 ns
Clock Frequency-Max (fCLK) 133 MHz
Supply Voltage-Nom (Vsup) 2.5 V
Package Style GRID ARRAY, FINE PITCH
Package Shape SQUARE
Package Equivalence Code BGA54,9X9,32
Package Code FBGA
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -25 °C
Operating Temperature-Max 85 °C
Number of Words Code 8000000Words Codes
Number of Words 8388608 wordsWord
Moisture Sensitivity Levels 1
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish MATTE TIN
HTS Code 8542.32.00.02
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B54
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.13 mA
Organization 8MX16
Output Characteristics 3-STATE
Memory Width 16
Standby Current-Max 0.0005 A
Memory Density 134217728 bit
I/O Type COMMON
Memory IC Type SYNCHRONOUS DRAM
Refresh Cycles 4096
Sequential Burst Length 1,2,4,8,FP
Interleaved Burst Length 1,2,4,8
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K4M28163LH-BN75 Documents

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