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K4S641633H-BL75 Tech Specifications

Category Memory
Manufacturer Samsung
Surface Mount YES
Number of Terminals 54Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Access Time-Max 5.4 ns
Clock Frequency-Max (fCLK) 133 MHz
Number of Words 4194304 wordsWord
Number of Words Code 4000000Words Codes
Operating Temperature-Max 70 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA54,9X9,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
ECCN Code EAR99
HTS Code 8542.32.00.02
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B54
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.135 mA
Organization 4MX16
Output Characteristics 3-STATE
Memory Width 16
Standby Current-Max 0.0005 A
Memory Density 67108864 bit
I/O Type COMMON
Memory IC Type SYNCHRONOUS DRAM
Refresh Cycles 4096
Sequential Burst Length 1,2,4,8,FP
Interleaved Burst Length 1,2,4,8
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K4S641633H-BL75 Documents

Download datasheets and manufacturer documentation for   K4S641633H-BL75

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