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Samsung Semiconductor K4T51163QE-ZCD5000 Memory ICs
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K4T51163QE-ZCD5000 Tech Specifications
| Category | Memory | |
| Manufacturer | Samsung | |
| EU RoHS | Compliant | |
| ECCN (US) | EAR99 | |
| HTS | 8542.32.00.02 | |
| Automotive | No | |
| PPAP | No | |
| DRAM Type | DDR2 SDRAM | |
| Chip Density (bit) | 512M | |
| Number of Internal Banks | 4Internal Banks | |
| Number of Words per Bank | 8M | |
| Number of Bits/Word (bit) | 16Bits/Word (bit)s | |
| Data Bus Width (bit) | 16 | |
| Maximum Clock Rate (MHz) | 533 | |
| Maximum Access Time (ns) | 0.5 | |
| Address Bus Width (bit) | 15 | |
| Interface Type | SSTL_1.8 | |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Typical Operating Supply Voltage (V) | 1.8 | |
| Maximum Operating Supply Voltage (V) | 1.9 | |
| Operating Current (mA) | 140 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 95 | |
| Supplier Temperature Grade | Commercial | |
| Number of I/O Lines (bit) | 16I/O Lines (bit)s | |
| Mounting | Surface Mount | |
| Package Width | 9 | |
| Package Length | 13 | |
| PCB changed | 84 | |
| Standard Package Name | BGA | |
| Supplier Package | FBGA | |
| Lead Shape | Ball | |
| Part Status | Obsolete | |
| Pin Count | 84 | |
| Organization | 32Mx16 |
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