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Samsung Semiconductor K4X56323PI-8GC3000 Memory ICs
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K4X56323PI-8GC3000 Tech Specifications
| Category | Memory | |
| Manufacturer | Samsung | |
| EU RoHS | Compliant | |
| ECCN (US) | EAR99 | |
| Automotive | No | |
| PPAP | No | |
| DRAM Type | Mobile-DDR SDRAM | |
| Chip Density (bit) | 256M | |
| Number of Internal Banks | 4Internal Banks | |
| Number of Words per Bank | 2M | |
| Number of Bits/Word (bit) | 32Bits/Word (bit)s | |
| Data Bus Width (bit) | 32 | |
| Maximum Clock Rate (MHz) | 266 | |
| Maximum Access Time (ns) | 6|8 | |
| Address Bus Width (bit) | 14 | |
| Interface Type | LVCMOS | |
| Minimum Operating Supply Voltage (V) | 1.7 | |
| Typical Operating Supply Voltage (V) | 1.8 |
| Maximum Operating Supply Voltage (V) | 1.95 | |
| Operating Current (mA) | 110 | |
| Minimum Operating Temperature (°C) | -25 | |
| Maximum Operating Temperature (°C) | 85 | |
| Supplier Temperature Grade | Extended | |
| Number of I/O Lines (bit) | 32I/O Lines (bit)s | |
| Mounting | Surface Mount | |
| Package Height | 1(Max) - 0.25(Min) | |
| Package Width | 8 | |
| Package Length | 13 | |
| PCB changed | 90 | |
| Standard Package Name | BGA | |
| Supplier Package | FBGA | |
| Lead Shape | Ball | |
| Packaging | Tray | |
| Part Status | Obsolete | |
| Pin Count | 90 | |
| Organization | 8Mx32 |
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