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K7I321882C-EC30000 Tech Specifications

Category Memory
Manufacturer Samsung
EU RoHS Compliant
ECCN (US) 3A991.b.2.a
HTS 8542.32.00.71
Automotive No
PPAP No
Chip Density (bit) 36M
Number of Words 2MWord
Number of Bits/Word (bit) 18Bits/Word (bit)s
Data Rate Architecture DDR
Address Bus Width (bit) 21
Timing Type Synchronous
Max. Access Time (ns) 0.45
Maximum Clock Rate (MHz) 303
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Operating Current (mA) 650
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
Mounting Surface Mount
Package Height 0.95
Package Width 15
Package Length 17
PCB changed 165
Standard Package Name BGA
Supplier Package FBGA
Lead Shape Ball
Part Status Obsolete
Pin Count 165
Number of Ports 1Port
Architecture Pipelined
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