KA358D Tech Specifications

Category Linear - Amplifiers - Special Purpose
Manufacturer Samsung
Surface Mount YES
Contact plating gold-plated
Number of pins 26pins
Number of Terminals 8Terminals
Part Life Cycle Code Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code SOIC
Package Description 0.225 INCH, SOP-8
Common-mode Reject Ratio-Nom 80 dB
Neg Supply Voltage Limit-Max -16 V
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Supply Voltage-Nom (Vsup) 5 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2mm
Electrical mounting SMT
Connector pinout layout 2x13
Row pitch 2mm
Gross weight 1.28 g
Operating temperature -40...163°C
ECCN Code EAR99
HTS Code 8542.33.00.01
Terminal Position DUAL
Terminal Form GULL WING
Number of Functions 2Functions
Terminal Pitch 1.27 mm
Reach Compliance Code compliant
Current rating 2.5A
Pin Count 8
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Supply Current-Max 2 mA
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
Seated Height-Max 1.95 mm
Average Bias Current-Max (IIB) 0.5 μA
Low-Offset NO
Frequency Compensation YES
Supply Voltage Limit-Max 16 V
Bias Current-Max (IIB) @25C 0.25 μA
Input Offset Voltage-Max 9000 μV
Rated voltage 100V
Voltage Gain-Min 15000
Profile beryllium copper
Length 4.9 mm
Width 3.9 mm
Plating thickness 0.254µm
Flammability rating UL94V-0
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