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M378A5244BB0-CTD00 Tech Specifications

Category Memory - Modules
Manufacturer Samsung
ECCN (US) EAR99
HTS 8473.30.11.40
Automotive No
PPAP No
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 4Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 2666
Chip Configuration 512Mx16
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Operating Current (mA) 780
ECC Support No
Number of Ranks SingleRank
CAS Latency 19
Mounting Socket
Package Height 31.25
Package Width 2.61(Max)
Package Length 133.35
PCB changed 288
Supplier Package UDIMM
Part Status LTB
Pin Count 288
Organization 512Mx64
Module Type 288UDIMM
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